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35 G XG-50 Solder PPD 183°C Original Sealed Low Dross Tin Solder BGA Paste for SMD Rework and Circuit Assembly

35 G XG-50 Solder PPD 183°C Original Sealed Low Dross Tin Solder BGA Paste for SMD Rework and Circuit Assembly

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What S1 Excellent means

Like new. Best choice for personal use.

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  • Every phone is tested and graded S1 to S5
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Price

₹314₹99969% off

Grade S1 Excellent, price ₹314

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S1 Excellent

₹314

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Highlights

  • 35G SOLDER PASTE: Convenient 35g container of XG-50 solder paste for professional electronics repair, assembly and DIY soldering work.
  • 183°C MELTING POINT: Designed with a 183°C melting point for controlled soldering and suitable SMD, PCB and BGA rework applications.
  • SN63/PB37 ALLOY: Leaded tin solder alloy formulated for reliable soldering performance and strong, consistent joints.
  • FOR SMD & BGA REWORK: Suitable for SMD components, BGA reballing, PCB repair, SMT assembly, QFN soldering and mobile motherboard repair.
  • SMOOTH & LOW-RESIDUE PERFORMANCE: Paste consistency helps with precise application and component positioning while supporting clean soldering results with reduced residue.

About this phone

The XG-50 solder paste is designed for precision electronics soldering, SMD rework, BGA repair, PCB assembly and chip-level motherboard repair. With a 183°C melting point and Sn63/Pb37 solder alloy, it provides smooth soldering performance and reliable solder joints.

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